The PI640i infrared microscope package, featuring 2X magnification, provides precise temperature data for small electronic devices and MEMS, crucial in semiconductor applications. Users can visualize thermal variations and measure minute targets, relying on detector resolution. Its optics focus infrared heat onto the IR camera’s detector elements. The highest-performing objective can detect 8 µm temperature changes within a 5.4 mm x 4.0 mm field of view. Integration of a high-resolution IR camera with German-designed objectives and precise adjustment facilitates accurate measurements. A pixel pitch of 17 µm allows a small MFOV of 4 x 4 pixels, ensuring precise measurements. The camera supports frame rates of 32 Hz or 125 Hz for microscopic thermal imaging.

The PI 640i infrared microscope kit with 2X magnification offers a solution tailored for engineers requiring precise temperature data for small electronic devices or Micro-Electro-Mechanical Systems (MEMS). This kit enables users to visualize thermal variations and conduct measurements on minute targets, a capability reliant on detector resolution. The system’s optics focus infrared heat energy from the device onto the IR camera’s detector elements, ensuring accurate and detailed thermal analysis of small components.

Engineers often encounter discrepancies between temperature measurements obtained using contact thermocouples and those from a properly equipped infrared camera, particularly when dealing with small targets. This disparity commonly arises due to the thermal bridge effect of the thermocouple connection, which conducts heat and affects measurement accuracy. In such cases, non-contact infrared cameras tend to yield more accurate results, as they avoid the heat conduction issues associated with contact methods.

Like microscopes functioning within the visible spectrum, selecting the appropriate optic involves a trade-off between the total observable field of view and the smallest target requiring observation and measurement. The highest-performing PI 640i microscope objective can detect temperature changes on targets as small as 8 µm within a field of view of 5.4 mm x 4.0 mm. Integrating a high-resolution IR camera with German-designed infrared microscope objectives and a precision mounting stage facilitates precise working distance adjustment, ensuring accurate and detailed thermal analysis of tiny components.

IR camera manufacturers often highlight a single pixel size or IFOV (Instantaneous Field of View) to showcase a camera’s ability to resolve small targets. However, it’s essential to recognize that accurate temperature measurement with an infrared camera necessitates multiple pixels. Cameras with smaller detector pitches require as many as 7 x 7 pixels to deliver temperature measurements within the camera’s specified accuracy. The MFOV (Measurement Field of View) specification plays a pivotal role in ensuring temperature measurements are correct.

In addition to low thermal noise, the optimal pixel pitch size of 17 µm for long-wavelength infrared radiation allows for a small Measurement Field of View (MFOV) of just 4 x 4 pixels. Using superior quality and larger optics ensures high image quality, minimizing distortion and ensuring uniform attenuation across the entire image. Various interchangeable lens optics are available to properly frame and maximize pixel count on the target to be measured. The infrared camera supports a frame rate of 32 Hz in standard mode or 125 Hz in high-speed subframe mode, enabling the monitoring of fast manufacturing processes.

The PI 640i is compatible with Optris PIX Connect software, which users can download for free and receive updates at no cost. This software package includes features such as hot spot and cold spot location detection, histograms, temperature profiling, image subtraction, and other thermal image processing tools. For researchers and process engineers, the PC-based PIX Connect platform offers robust thermal image processing capabilities, allowing users to extract and document fully calibrated temperature measurements from any pixel in the scene.

Time-versus-temperature data can be extracted from live thermal video feeds and recorded thermal video files containing stored temperature data. Engineers can utilize the data collection capabilities to extract the highest, lowest, and average temperatures from areas of any size or shape and receive complex alarm signals. Furthermore, the system supports replaying stored thermal video frame by frame, enabling engineers to capture and store radiometric images and trigger snapshots during temperature changes. This functionality ensures comprehensive monitoring and detailed analysis of thermal events over time.

Many engineers gather data from multiple locations on electronic devices over extended periods using the Temperature/Time feature, which logs data at user-specified intervals and stores it in .csv files. Some engineers prefer obtaining full images and utilizing calibrated sequence files or calibrated .tiff images, which can be captured at user-specified intervals. The Snapshot sequence storage routine also facilitates CSV file storage of the complete temperature matrix at user-specified intervals, providing a comprehensive record of temperature data for detailed analysis and reporting.

Features