The Xi 400 infrared camera system, equipped with microscope optics, is dedicated to printed circuit board analysis and electrical component temperature measurement at a budget-friendly 382 x 288 resolution. Combining a long-wave infrared camera with a precise focus microscope stage and German-designed optics optimized for small targets, the IR imager measures the smallest details. In the electronics industry, where small devices are common, infrared camera systems typically lack optics for such targets. Specifications like IFOV and MFOV are crucial for accurate temperature measurement. Its high frame rate of up to 80 Hz and seamless computer connectivity make it suitable for monitoring fast thermal manufacturing processes.

The Xi 400 with microscope optics is the most powerful infrared camera system for printed circuit board analysis and electrical component temperature measurement in the affordable 382 x 288 resolution range. It combines a long-wave infrared camera with a microscope stage for precise focus and German-designed infrared optics optimized for small target images and measurement. This powerful infrared camera package is available in most markets at a budget-friendly price.

Small devices and connections in the electronics industry are common, but most infrared camera systems are built with optics optimized for larger targets. Various specifications are used to describe infrared resolution, making product comparison more difficult. Terms such as Instantaneous Field of View (IFOV), milliradian (mrad), pixel size, detector pitch, and Measurement Field of View (MFOV) are used by different manufacturers to specify this important performance attribute. This variation is partly driven by application requirements, where some cases prioritize temperature increase detection while others require accurate temperature measurement for component specification validation.

To simplify the process of communicating infrared camera resolution, rely on the “IFOV” specification (used interchangeably with spot size or pixel size) to determine a camera’s ability to detect temperature change. Use MFOV to determine a camera’s ability to make an accurate temperature measurement within the IR camera’s accuracy specification. Most manufacturers do not include the MFOV specification, so check with the supplier or multiply the IFOV by a minimum of three to determine a camera’s ability to measure temperature accurately.

The Optris Xi 400 with microscope package is promoted as a superior solution for electronics applications because it was developed with optics designed specifically for this purpose, delivering both a small IFOV (80 µm) and a small MFOV (240 µm). If you are validating small chip operating temperatures and are not aware of this important distinction, you may assume your device is operating within its temperature specification when it is actually running hot and destined to fail early in the product’s lifetime. Accurate remote infrared temperature measurements have great value in many applications, but extracting and analyzing this data from the infrared camera system in other environments can often be challenging.

The Optris Xi 400 offers seamless computer connectivity through its primary USB interface and boasts an impressive frame rate of 80 Hz. This high frame rate allows for the monitoring of fast thermal processes, especially in the line-scan mode, ensuring precise and timely thermal data collection for dynamic applications.

Optris PIX Connect software addresses the challenge of data extraction and analysis by including a Time vs. Temperature measurement feature, which logs data at user-specified intervals and stores it in .csv files. Engineers who prefer full images can use calibrated sequence files or calibrated .tiff images, captured at user-specified intervals. The Snapshot Sequence Storage routine also supports .csv file storage of the complete temperature matrix at user-specified intervals.

With its analog and digital outputs and a process interface, the Xi 400 infrared camera is well-suited for supplying control input to machines and equipment. Software developer kits are available for integrators developing application-specific software solutions. For shorts or fault detection, the software allows engineers to easily optimize temperature display settings to detect even the slightest temperature increases. For more challenging applications, an image subtraction feature is available, enabling users to subtract a live image (such as a fully energized printed circuit board) from the same board with a lower current input, highlighting temperature differences more effectively.

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